Process Gas Distribution and Control - Seminar Module Outline
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Introduction |
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Groundrules, instructor introduction, objectives |
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Course overview (tailored to specific course content) |
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The nature of engineering requirements |
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Authority, tradition, standards, and common knowledge vs. data |
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To progress we must be willing to see things differently |
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Classifying requirements (exercize) |
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The nature of gases |
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The usefulness of gases |
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What is different about handling semiconductor process gases? |
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What is different about measuring semiconductor process gases? |
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The ideal gas law |
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Volumetric flow vs. mass flow |
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Why use volumetric units for mass flow? |
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Surface effects - adsorption |
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Basic semiconductor structures |
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CMOS transistor, contact and DRAM structure |
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Interconnect |
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Basic semiconductor processes using gases |
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Themes in wafer processing |
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Elements of the process environment |
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Chemical reaction with the wafer |
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Dry etch |
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Principles of dry etch |
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Deposition |
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Cleaning the process chamber |
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Gas distribution |
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Distribution system architecture |
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Elements of the system |
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Alternative architectures |
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Pressure levels within the system |
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Safety |
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Pressure ratings |
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Leak integrity |
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Isolation |
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Ventilation |
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Double containment |
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Flow limitation |
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Abatement |
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Connections and splices |
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Connecting the parts of the system |
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Sealing methods compared |
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Gaskets and seals - examples |
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Fittings |
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Welding |
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Bending |
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Purging |
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Displacement |
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Concentration differential |
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Entrainment |
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Cycle |
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Automated purging |
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Leaks |
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Internal vs. external leaks |
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What is likely to leak? |
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What causes leaks? |
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The effects and consequences of leaks |
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Inert gases |
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Movement of gas through a leak, bidirectional diffusion |
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corrosive gases |
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Pyrophoric gases |
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Toxic gases |
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Measuring system leak integrity |
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Pressure decay testing |
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Helium mass spectrometer |
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Virtual leaks |
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Dead legs |
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Crevices and cavities |
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Surface effects |
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Detecting hazardous gas in ambient air |
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Cylinder cabinets |
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Typical valve panels |
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Bulk gas supply |
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Valve manifold boxes |
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Condensable / corrosive / reactive gases |
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Safe Delivery System (SDS) |
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SDS vs. high pressure sources |
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adsorption / desorbtion curves vs. pressure |
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cylinder capacity table |
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Vaporized liquids distributed as gases |
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examples |
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Preventing condensation in the delivery system |
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Selective distillation in the bottle |
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Liquids which are vaporized at point-of-use |
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examples |
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bubblers vs. vaporizers |
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metering the liquid vs. metering the vapor |
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Liquid handling |
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Unstable gases |
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highly diluted mixtures |
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Ozone |
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Gas purity |
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Particles |
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Particle sources |
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Detecting and measuring particles |
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Laser particle counters |
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CNC particle counters |
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Molecular contaminants |
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Moisture |
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Moisture measurement |
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Chemical impurities |
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Materials of construction |
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Surface finish |
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Surface passivation |
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Flow control |
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Flow Calibration Metrology |
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Primary or secondary? |
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Transfer standards get no respect |
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Dealing with nasty gases |
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Volumetric primary |
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Variable pressure primary |
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Gravimetric primary |
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Critical flow nozzles |
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Laminar flow elements |
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Thermal mass flow meters |
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Calibration Traceability |
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Flow controllers, general |
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Mass flow control requirements |
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Closed-loop controllers |
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Controller error |
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Control and monitoring signals |
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Analog vs. digital signaling |
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Proportional control valves, magnetic, piezoelectric |
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Thermal MFCs |
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Thermal MFC issues |
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Thermal mass flow measurement |
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Thermal sensor principles |
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Thermal sensor excitation options |
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Ranging with shunts (bypasses) |
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Split ratio issues (bypass - sensor behavior differences) |
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Thermophysical gas properties |
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Density |
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Molar specific heat |
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Thermal conductivity |
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Viscosity |
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Conversion functions |
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Sources of error |
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How to upset an MFC by design |
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Strengths and weaknesses |
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Pressure based MFCs |
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Introduction to pressure based flow measurement |
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Sonic flow devices |
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Orifice vs. nozzle |
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LFE based devices |
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Pressure based MFC issues |
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conversion functions |
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Sources of error |
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Thermal vs. pressure MFCs: strengths and weaknesses |
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Micro-machined devices |
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Liquid MFCs |
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Flow controller specification parameters (definition, measurement, typical values) |
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Accuracy |
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Turndown |
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Repeatability |
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Reproducibility |
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Hysterisis |
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Long-term stability, zero, span |
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Temperature effects |
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Zero effect |
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Span effect |
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Pressure effects |
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Steady-state |
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Transient |
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Transient characteristics |
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Typical response curves |
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Starting, changing and stopping flow |
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Dead time, response time, settling time |
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Measuring transient characteristics |
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Settling the last two percent |
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Electrical supply effects |
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System effects |
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Sequencing |
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Valves |
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Actuators |
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Manual |
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Manual with lockout / tagout |
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Pneumatic |
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Moving seals |
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Bellows |
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Diaphragm |
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Poppet / seat |
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Soft seats |
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all-metal valves |
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Cv - flow capacity |
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Pressure rating |
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Inlet vs. outlet |
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Multi-ported valves |
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Pilot valves |
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Actuation delay |
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Valve failure modes |
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Valve position detectors |
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Pressure regulators |
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How mechanical regulators work |
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Loading the diaphragm |
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Connecting the valve to the diaphragm |
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The significance of mechanical gain and damping |
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Characteristics / specifications |
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Lockup / creep |
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Burp |
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Inlet pressure effect |
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Droop |
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Oscillation |
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Electronic regulators |
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Regulator failure modes |
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Interactions between regulators and MFCs |
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Filters and purifiers |
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What makes filters work? |
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Filter material |
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Teflon |
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Metal |
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Ceramic |
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Flow resistance |
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Purifiers |
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Purifier types / strengths / weaknesses |
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Getter |
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Resin |
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Molecular sieve |
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Chemical sequestering |
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Gas compatibility |
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End-point detection |
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Pressure measurement |
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Mechanical pressure gauges |
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Bourdon tube |
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Electronic gauges |
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Diaphragms and other isolation structures |
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Sensing the force |
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Strain gauge |
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Semiconductor gauge |
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Variable capacitance |
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Characteristics / specifications |
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Working range |
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Accuracy |
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Repeatability |
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Hysterisis |
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Process tool gas systems |
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The gas stick |
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Simple gas systems |
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The inert gas stick |
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Reactive gas sticks |
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Designing for efficient purging |
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Gas isolation |
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Interlocks |
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Heating lines |
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Maintaining system purity while servicing components |
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System design checklist |
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Questionable practices |
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Safety and design standards |
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Modular / integrated gas systems |
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Gas box (and tool) control architecture |
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Analog interface with central control |
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Sensor bus with central control |
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Sensor bus with distributed control |
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Multiple sensor buses with distributed control |
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Implementing sensor bus at a low level: implications |
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Troubleshooting gas systems |
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Symptoms |
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No flow |
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MFC will not control above some setpoint |
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MFC will not control below some setpoint |
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Flow oscillates |
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The first wafer effect |
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(this section still in development) |